Though there are many RF applications, especially those with operating frequencies in the upper microwave and millimeter-wave spectrum, that rely on hand assembly and testing, there are now an increasing number of RF applications that require automated test equipment (ATE) and systems. For instance, the sheer volume and repetitiveness of semiconductor wafers and chips is much better suited for automated systems than hands-on testing for a variety of reasons. A few major factors are cost, time, and footprint of the test equipment and test station space required for personnel to perform hands on testing. Another key aspect is the repeatability of testing, which is much higher with ATE and automated testing systems than with hands-on testing.<\/p>\n
Common RF Devices Testing With ATE<\/strong> There are also now many new ATE models that are designed with modular and programmable systems that can be used to perform RF, analog, power, digital control, high-speed digital signals, microwave, and millimeter-wave testing in a single unit, or using a single control unit and several modular accessories.<\/p>\n Types of ATE<\/strong> Also, there are other types of ATE that are self-contained test units that are compact, portable, and can be synchronized and controlled by a common computer (PC-driven). Modular ATE tends to be lower cost and more customizable than purpose built ATE, but may also not be capable of the same level of speed and performance as purpose built ATE for a given application.<\/p>\n Common ATE Sub-components<\/strong> The type of ATE system used depends on the application and its requirements. Some ATE systems are designed to complete a simple test that takes a relatively small amount of time with limited digital control, power, and RF port requirements. More complicated ATE testing could range to the latest 5G MIMO and beamforming testing that requires an anechoic chamber and complex test apparatus with a moving gimbal and possibly a multitude of probes.<\/p>\n RF ATE Requirement Categories<\/strong> Though there are many RF applications, especially those with operating frequencies in the upper microwave and millimeter-wave spectrum, that rely on hand assembly and testing, there are now an increasing number of RF applications that require automated test equipment (ATE) and systems. For instance, the sheer volume and repetitiveness of semiconductor wafers and chips is ..<\/p>\n","protected":false},"author":5,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[481],"tags":[570,571],"class_list":["post-1534","post","type-post","status-publish","format-standard","hentry","category-rf-testing","tag-ate","tag-automated-test-equipment"],"yoast_head":"\n
\n\u2022 Semiconductor wafers with high-speed digital or RF devices and components
\n\u2022 Wireless communications chips, such as those for cellular, WiFi, and other IoT applications
\n\u2022 High volume microwave monolithic integrated circuits (MMICs)
\n\u2022 Standard packaged RF devices\/components
\n\u2022 Mid- or high-volume military or industry components that must meet quality control and qualifying performance
\n\u2022 Any device that can be automatically tested to EMC standards, such as FCC, CRISPR, CE, and etc.<\/p>\n
\n\u2022 Bench-top or all-in-one units (often with GPIB or ethernet control)
\n\u2022 VXI-based card-type units (requires a computer control\/interface and platform)
\n\u2022 Portable units that are PC-driven (often with ethernet or USB control)
\n\u2022 Programmable units that are standalone (often bench-top)
\n\u2022 Custom rack-mount units that may combine a variety of custom or purchased components possibly with custom interface and interconnect<\/p>\n
\n\u2022 Signal sources (frequency synthesizers, local oscillators, PLLs, mixers, digital-to-analog converters etc.)
\n\u2022 Receivers (low noise amplifiers, analog-to-digital converters, mixers, isolators, filters, limiters, attenuators etc.)
\n\u2022 Splitters and combiners for splitting signal sources
\n\u2022 Interface sections which may be modular
\n\u2022 RF ports
\n\u2022 Digital control or high-speed digital test ports
\n\u2022 DC power ports
\n\u2022 Analog ports
\n\u2022 Upconverters\/downconverters
\n\u2022 Direction couplers
\n\u2022 Power Amplifiers
\n\u2022 Voltage controlled oscillators
\n\u2022 Switch\/Switch Matrices<\/p>\n
\n\u2022 Type of tests (single domain, multi-domain)
\n\u2022 Quantity and frequency of tests\/RF ports
\n\u2022 RF input power levels and output power levels
\n\u2022 Digital control
\n\u2022 High-speed digital signals and RF testing
\n\u2022 Test throughput (dicates ATE test time, often limited by the handler dynamics)
\n\u2022 DC power supplies (type, power level, quantity)
\n\u2022 RF performance requirements (frequency, bandwidth, noise, phase noise, \u2022 VSWR, dynamic range. Linearity etc.)
\n\u2022 Test repeatability, calibration procedure\/time, and zeroing procedure\/time
\n\u2022 Configuration complexity and cost
\n\u2022 Size and cost of the ATE (relates to CAPEX and OPEX considerations)
\n\u2022 Maintenance and operating life of the ATE (relates to OPEX considerations)<\/p>\n","protected":false},"excerpt":{"rendered":"